Research on Micro-Level Height Control System for Semiconductor Wafer Cutting Machine

DOI: https://doi.org/10.62517/jes.202402406

Author(s)

Linlin Chen1,*, Pengfei Song2

Affiliation(s)

1Zhengzhou University of Science and Technology, Zhengzhou, Henan, China 2United Auto Battery Co., Ltd., Changzhou, Jiangsu, China *Corresponding Author.

Abstract

Wafer cutting is one of the key steps in the semiconductor chip manufacturing process, which is important for improving wafer utilization and cost effectiveness, ensuring product quality and performance, supporting more integrated and smaller chip manufacturing, and enabling the production of multiple chips. Height measurement is to accurately measure the height between the blade and the wafer when the wafer cutter performs precision cutting, and contact height measurement is required. This paper studies the height measuring control system of wafer cutting machine. The different resistance values of different cutter blades may cause the instability of height measuring. An auxiliary height measuring circuit is designed to trigger the height measuring circuit according to voltage. The circuit uses a single chip microcomputer as the main control chip, the AD converter and the voltage regulator chip TL431 in the circuit ensure the measurement accuracy, and the feasibility is verified by Protues simulation software. The experimental results show that the improved auxiliary height measuring circuit can be used to improve the safety and stability of the height measuring circuit.

Keywords

Wafer; Cutting Machine; Micron Scale; Height Measurement; Control System

References

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